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International Master's Program in Advanced Semiconductor Packaging and Testing

The International Master's Program in Advanced Semiconductor Packaging and Testing is a 2-year program offered by the Institute of Advanced Semiconductor Packaging and Testing.

Admission Information

• Application Period: January 15 – March 15, 2026
• Admission Results: Before June 5, 2026
• Semester Begins: Mid-September 2026

Research Fields

• Electronics
• Semiconductor
• Device
• Control
• Communication
• Thermal-fluid
• Solid Mechanics
• Design and Manufacturing
• Micro/Nano Systems
• Material Science and Engineering
• Polymer Science
• Chemistry and chemical engineering
• Photonic materials and devices

Study Subsidy

During the two-year study period, the partner enterprise will provide each international student with a study subsidy totaling approximately NTD 430,000, which includes:

• A monthly living allowance of NTD 10,000
• A monthly housing allowance of NTD 3,000
• A tuition and miscellaneous fees subsidy of approximately NTD 120,000 for the two-year period Additionally, the institute will waive tuition and miscellaneous fees, valued at approximately NTD 120,000 over two years.

Part-time Work Opportunities

During the second year of the master's program, international students may be offered up to 40 hours per month of part-time work opportunities by the partner enterprise.

Post-Graduation Employment

Fresh graduates must work in the cooperative enterprise for at least 2 years. Upon receiving admission notification, each international student must sign and submit the "Agreement on Study Subsidy Disbursement and Repayment, and Post-Graduation Employment Service" to complete the enrollment process.