Program Overview

Program Overview

The Packaging et Durabilitť program is a comprehensive course that focuses on the principles and applications of packaging in microelectronics and durability in electrochemistry.

Informations Gťnťrales

• Volumes horaires:
  • CM 6.0
  • Projet 0
  • TD 6.0
  • Stage 0
  • TP 4.0
• Crťdits ECTS: 1.5

Objectif(s)

The program aims to:

• Provide a general overview of microelectronic assembly processes
• Present the main phenomena involved in these processes, such as wetting, diffusion, and interfacial reactivity
• Give basic notions on the physico-chemistry of interfaces involved in different assembly processes in the electronic industry
• Apply this knowledge to real cases of packaging in the electronic industry
• Provide notions of material selection criteria for electrolyte, cathode, anode, and interconnections
• Provide notions of durability in solid-state electrochemistry
• Give an overview of economic aspects and technological trends and orientations

Contenu(s)

The program is divided into two main parts:

I) Packaging (10h)

• The role of packaging in microelectronics
• Packaging of integrated circuits, techniques used (WB - wire-bonding, FC - flip chip, TAB - tape Automated Bonding,...)
• Families (SMP, THP,...), types of packaging (PGA - pin grid array, BGA - ball grid array, ...) and different cases (plastic, ceramic)
• Materials used (advantages and limitations)
• Packaging of microsystems
• Description and study of physico-chemical and mechanical phenomena occurring during assembly (thermodynamics, kinetics, wetting,...)
• Study of specific cases in packaging (Design Office)

II) Durability (6h)

• Principle of operation of a solid oxide fuel cell (SOFC)
• Packaging: from the elementary cell to the stack
• Economic aspects, technological locks, and trends
• Role of materials used: electrolyte, electrodes, interconnectors (advantages and limitations)
• Problems of piles operating at high temperature (durability)
• Solutions to reduce the operating temperature of the SOFC

Prťrequis

• Thermodynamics
• Surfaces-Interfaces
• Phase diagrams
• Electrochemistry

ContrŰle des Connaissances

The assessment of knowledge is done through:

• A written exam (DS) + design office (BE) during the normal session
• A written exam during the retake session
• The design office is not retakeable

Informations Complťmentaires

• The course is taught only in English
• The program is part of the Semestre 9 curriculum for several engineering courses

Bibliographie

• Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill, 2001
• Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley
• C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000
• J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998
• R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001