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Introduction to Wire Bonding
Cardiff UniversityCardiff, United Kingdom
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Program Details
- Degree
- Courses
- Major
- Electrical Engineering | Materials Engineering | Manufacturing Technology
- Area of study
- Engineering | Manufacturing and Processing
- Course Language
- English
Program Overview
Introduction to Wire Bonding
The Introduction to Wire Bonding course provides theoretical and practical understanding of the wire bonding process as a key microelectronic interconnection technique. This course helps participants understand how wire bonding equipment works and informs better decision-making when implementing the wire bonding process.
Who it's for
This course is designed for anyone exposed to or developing the wire bonding process, particularly employees of the compound semiconductor cluster in South Wales (known as CSconnected) and those working in the packaging of semiconductor modules and devices. The training is also relevant for individuals working in the semiconductor sector globally, as well as their supply chain partners and anyone interested in wire bonding.
What you'll learn
By the end of the course, participants will be able to:
- Explain what wire bonding is and its function within the wider semiconductor supply chain
- Understand the performance expected from a good wire bond
- Describe the generic step-by-step processes involved in wire bonding and how the machinery works
- Explain the similarities and differences between ball bonding, wedge bonding, and ribbon bonding techniques, including their pros and cons
- Know which materials can be used in the wire bonding process and which materials to select according to the outcomes needed
- Understand the different parameters that affect the 'recipe' when wire bonding and how changing the parameters affects the outcome
- Know how to validate the quality of wire bonding through pull tests and shear tests
- Know about the main safety issues to be aware of when wire bonding
- Know the professional standards used for wire bonding
Topics covered
The course covers the following topics:
- Examples of wire bonding and machinery
- Materials used for wire bonding
- Steps in the wire bonding process, including:
- Known wire material requirements
- Target sample/product setting
- Pre-recipe searching
- Bonding
- Ball and wedge bonding techniques
- Parameters affecting the 'recipe', including:
- Time
- Ultrasonic Power
- Force
- Temperature
- Wire materials – Gold, Aluminium, Copper
- Ball, wedge, and ribbon bonding
- Wire shape – tail, bridge height, etc
- Fundamentals of ultrasonic, thermosonic, and thermocompression bonding
- Current carrying capacity and fusing limits
- Metallurgical interactions
- Trouble-shooting – what can go wrong during processing and in service
- Advanced wire/ribbon bonding processes – laser and laser/ultrasonic
- Equipment manufacturers and the supply chain
- Validation of the process – quality and tests
- Wire pull
- Ball shear
- Wire pull and ball shear failure mode interpretation (ball lift, shear, wire break on 1st, 2nd bond)
- Loop height
- Ball diameter
Benefits
This course has been designed in collaboration with industry partners from the CSconnected cluster and uses funding provided by UKRI's Strength in Places Fund.
Course leads
The course leads are:
- Dr Daniel Wang, Cardiff's Institute of Compound Semiconductors (ICS)
- Steve Riches, iMAPS-UK
- Andy Longford, iMAPS-UK
- Sirin Sunny, Accelonix UK
Funding available
Funding is available for individuals and organisations, including:
- ReAct+ – up to £1,500 for relevant skills training for those 18+ who are resident in Wales and unemployed or under formal notice of redundancy
- Flexible Skills Programme funding – up to 50% funding support to Wales-based businesses
Location
The course is held at Queen's Buildings, 5 The Parade, Cardiff, CF24 3AA.
About University
Cardiff University
Overview:
Cardiff University is a leading research-intensive university located in the heart of Cardiff, the capital city of Wales. It is known for its strong academic reputation, diverse range of programs, and commitment to community engagement.